The introduction to VLSI fabrication techniques, integrated circuit designs and advanced semiconductor devices will give a proper perspective of the past, present and future trends in the VLSI industry. Following the evolution of MOS and bipolar devices, digital and analog CMOS, BiCMOS, deep submicron CMOS, SOI-CMOS, RF-CMOS and HV-CMOS technologies will be studied. Special attention will be given to the physical scaling limits such as short channel effects. In addition, CAD tools and design methodology for the development of advanced semiconductor devices and integrated circuits will be introduced in the laboratory environment. These include the simulation of device fabrication, device characteristics, device modeling, circuit layout, design verification. Finally, advanced technology such as GaN HEMTs, graphene devices, carbon nano-tube devices, power devices, heterojunctions, InP and GaSb HBTs will also be studied.
Fixed Credit Value